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? semiconductor ML9206-XX 1/32 ? semiconductor ML9206-XX 5 7 dot character 16-digit display controller/driver with character ram general description the ML9206-XX is a dot matrix vacuum fluorescent display tube controller driver ic which displays characters, numerics and symbols. dot matrix vacuum fluorescent display tube drive signals are generated by serial data sent from a micro-controller. a display system is easily realized by internal rom and ram for character display. the ML9206-XX has low power consumption since it is made by cmos process technology. -01 is available as a general-purpose code. custom codes are provided on customer's request. features ? logic power supply and vacuum fluorescent display tube drive power supply (v dd ) : 3.3 v 10% or 5.0 v 10% ? fluorescent display tube drive power supply (v fl ) : C20 to C60 v ? vfd driver output current (vfd driver output can be connected directly to the fluorescent display tube. no pull-down resistor is required.) - segment driver (seg1 to seg35) : C6 ma (v fl =C60v) - segment driver (ad1 and ad2) : C15 ma (v fl =C60v) - grid driver (com1 to com16) : C30 ma (v fl =C60v) ? general output port output current - output driver (p1 and p2) : 1 ma (v dd =3.3v 10%) 2 ma (v dd =5.0v 10%) ? content of display - cgrom 5 7 dots : 248 types (character data) - cgram 5 7 dots : 8 types (character data) - adram 16 (display digit) 2 bits (symbol data) - dcram 16 (display digit) 8 bits (register for character data display) - general output port 2 bits (static operation) ? display control function - display digit : 1 to 16 digits - display duty (brightness adjustment) : 256 stages - all lights on/off ? 3 interfaces with microcontroller : da, cs , cp (4 interfaces when reset is added) ? 1-byte instruction execution (excluding data write and display duty set mode to ram) ? built-in oscillation circuit (external r and c) ? package options: 64-pin plastic qfp (qfp64-p-1414-0.80-bk) (product name : ML9206-XXgs-bk) 64-pin plastic ssop (ssop64-p-525-0.80-k) (product name : ML9206-XXgs-k) xx indicates the code number. e2c0042-19-62 this version: jun. 1999
? semiconductor ML9206-XX 2/32 block diagram v dd gnd v fl reset da cp cs osc0 osc1 seg1 seg35 ad1 ad2 p1 p2 com1 com16 dcram 16w 8b cgrom 248w 35b cgram 8w 35b adram 16w 2b 8bit shift register command decoder control circuit timing generator 1 oscillator timing generator 2 digit control duty control grid driver port driver ad driver segment driver write address counter read address counter address selector
? semiconductor ML9206-XX 3/32 input and output configuration schematic diagrams of logic portion input and output circuits input pin output pin schematic diagram of driver output circuit gnd v dd gnd input v dd gnd v dd gnd output v dd v fl v dd v fl output v dd
? semiconductor ML9206-XX 4/32 pin configuration (top view) nc: no connection 64-pin plastic qfp 48 47 46 45 44 43 42 41 40 39 38 1 2 3 4 5 6 7 8 9 10 11 seg5 seg6 seg7 seg8 seg9 seg10 seg11 seg12 seg13 seg14 seg15 v fl com16 com15 com14 com13 com12 com11 com10 com9 com8 com7 64 63 62 61 60 59 58 57 56 55 54 seg4 seg3 seg2 seg1 ad1 ad2 p2 p1 v dd da cp 17 18 19 20 21 22 23 24 25 26 27 seg21 seg22 seg23 seg24 seg25 seg26 seg27 seg28 seg29 seg30 seg31 12 seg16 13 seg17 14 seg18 15 seg19 16 seg20 28 seg32 29 seg33 30 seg34 31 seg35 32 com1 37 com6 36 com5 35 com4 34 com3 33 com2 53 cs 52 reset 51 osc1 50 osc0 49 gnd
? semiconductor ML9206-XX 5/32 20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 seg16 p1 p2 ad2 ad1 seg1 seg2 seg3 seg4 seg5 seg6 seg7 seg8 seg9 seg10 seg11 seg12 seg13 seg14 seg15 com6 v dd da cp cs reset osc1 osc0 gnd v fl com16 com15 com14 com13 com12 com11 com10 com9 com8 com7 45 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 21 22 23 24 25 26 27 28 29 30 31 32 44 43 42 41 40 39 38 37 36 35 34 33 seg17 com5 seg18 com4 seg19 com3 seg20 com2 seg21 com1 seg22 seg35 seg23 seg34 seg24 seg33 seg25 seg32 seg26 seg31 seg27 seg30 seg28 seg29 64-pin plastic ssop
? semiconductor ML9206-XX 6/32 pin description 1 to 31, 61 to 64 pin qfp type connects to fluorescent display tube anode electrode drive output. directly connected to fluorescent display tube and a pull-down resistor is not necessary. i oh > C6 ma description symbol ssop fluorescent tube anode electrode 5 to 39 seg1 to 35 o fluorescent display tube grid electrode drive output. directly connected to fluorescent display tube and a pull-down resistor is not necessary. i oh > C30 ma fluorescent tube grid electrode 40 to 55 com1 to 16 o 32 to 47 fluorescent display tube anode electrode drive output. directly connected to fluorescent display tube and a pull-down resistor is not necessary. i oh > C15 ma fluorescent tube anode electrode 3, 4 ad1, ad2 o 59, 60 general port output. output of these pins in static operation, so these pins can drive the led. led drive control pins 1, 2 p1, p2 o 57, 58 64 v dd 56 57 gnd 49 56 v fl 48 power supply v dd -gnd are power supplies for internal logic. v dd -v fl are power supplies for driving fluorescent tubes. apply v fl after v dd is applied. serial data input (positive logic). input from lsb. micro- controller 63 da i 55 shift clock input. serial data is shifted on the rising edge of cp . micro- controller 62 cp i 54 chip select input. serial data transfer is disabled when cs pin is "h" level. micro- controller 61 cs i 53 reset input. "low" initializes all the functions. initial status is as follows. ? address of each ram ? data of each ram ? display digit ? brightness adjusment ? all lights on or off ? all outputs address "00"h content is undefined 16 digits 0/256 off mode "low" level reset r 2 c 2 (circuit when r and c are connected externally) see application circuit. 60 reset i 52 micro- controller or c 2 , r 2 external rc pin for rc oscillation. connect r and c externally. the rc time constant depends on the v dd voltage used. set the target oscillation frequency to 2 mhz. osc0 osc1 r 1 c 1 (rc oscillation circuit) see application circuit. 58 osc0 i 50 59 osc1 o 51 c 1 , r 1
? semiconductor ML9206-XX 7/32 absolute maximum ratings parameter supply voltage (1) symbol condition rating unit supply voltage (2) input voltage power dissipation storage temperature output current v dd v fl v in p d t stg i o3 ta 3 25c com1 to com16 ad1, ad2 seg1 to seg35 C0.3 to +6.5 C80 to v dd +0.3 C0.3 to v dd +0.3 541 C55 to +150 C10 to 0.0 v v v mw c C40 to 0.0 C20 to 0.0 ma i o1 i o2 i o4 p1, p2 C4.0 to +4.0 qfp 590 ssop recommended operating conditions-1 when the power supply voltage is 5v (typ.) parameter supply voltage (1) symbol condition min. typ. max. unit supply voltage (2) high level input voltage low level input voltage cp frequency oscillation frequency frame frequency operating temperature v dd v fl v ih v il f c t op all input pins excluding osc0 pin all input pins excluding osc0 pin r 1 =3.3k w , c 1 =47pf digit=1 to 16, r 1 =3.3k w , c 1 =47pf 4.5 C60 0.7v dd C40 5.0 5.5 C20 0.3v dd 2.0 +85 v v v v mhz c 1.5 183 2.0 244 2.5 305 mhz hz f osc f fr
? semiconductor ML9206-XX 8/32 recommended operating conditions-2 when the power supply voltage is 3.3v (typ.) parameter supply voltage (1) symbol condition min. typ. max. unit supply voltage (2) high level input voltage low level input voltage cp frequency oscillation frequency frame frequency operating temperature v dd v fl v ih v il f c t op all input pins excluding osc0 pin all input pins excluding osc0 pin r 1 =3.3k w , c 1 =39pf digit=1 to 16, r 1 =3.3k w , c 1 =39pf 3.0 C60 0.8v dd C40 3.3 3.6 C20 0.2v dd 2.0 +85 v v v v mhz c 1.5 183 2.0 244 2.5 305 mhz hz f osc f fr electrical characteristics dc characteristics-1 parameter symbol applied pin condition min. max. unit high level input voltage v ih cs , cp , da, reset cs , cp , da, reset reset low level input voltage v ih =v dd v il =0.0v cs , cp , da, reset v il i ih i il high level input current low level input current high level output voltage v oh1 v oh2 v oh3 v oh4 com1 to 16 ad1, ad2 seg1 to 35 p1, p2 i dd1 p1, p2 com1 to 16 ad1, ad2 seg1 to 35 v dd i oh1 =C30ma i oh2 =C15ma i oh3 =C6ma i oh4 =C2ma duty=240/256 digit=1 to 16 all output lights on low level output voltage supply current 0.7v dd C1.0 C1.0 v dd C1.5 v dd C1.5 v dd C1.5 v dd C1.0 0.3v dd +1.0 +1.0 1.0 4 3 v v a a v v v v v ma ma (v dd =5.0v10%, v fl =C60v, ta=C40 to +85c, unless otherwise specified) cs , cp , da, v fl +1.0 v i ol1 =2ma v ol2 v ol1 i dd2 f osc = 2mhz, no load duty=128/256 digit=1 to 9 all output lights off
? semiconductor ML9206-XX 9/32 dc characteristics-2 parameter symbol applied pin condition min. max. unit high level input voltage v ih cs , cp , da, reset cs , cp , da, reset reset low level input voltage v ih =v dd v il =0.0v cs , cp , da, reset v il i ih i il high level input current low level input current high level output voltage v oh1 v oh2 v oh3 v oh4 com1 to 16 ad1, ad2 seg1 to 35 p1, p2 i dd1 p1, p2 com1 to 16 ad1, ad2 seg1 to 35 v dd i oh1 =C30ma i oh2 =C15ma i oh3 =C6ma i oh4 =C1ma duty=240/256 digit=1 to 16 all output lights on low level output voltage supply current 0.8v dd C1.0 C1.0 v dd C1.5 v dd C1.5 v dd C1.5 v dd C1.0 0.2v dd +1.0 +1.0 1.0 3 2 v v a a v v v v v ma ma (v dd =3.3v10%, v fl =C60v, ta=C40 to +85c, unless otherwise specified) cs , cp , da, v fl +1.0 v i ol1 =1ma v ol2 v ol1 i dd2 f osc = 2mhz, no load duty=128/256 digit=1 to 9 all output lights off
? semiconductor ML9206-XX 10/32 parameter symbol condition min. max. unit cp pulse width da setup time da hold time cs setup time cs hold time cs wait time data processing time reset pulse width da wait time all output slew rate v dd rise time t cw t ds t dh t css t csh t csw t doff t wres t rsoff t r t prz r 1 =3.3k w , c 1 =47pf r 1 =3.3k w , c 1 =47pf t r =20% to 80% t f =80% to 20% when mounted in the unit 250 250 250 250 16 250 8 250 2.0 100 ns ns ns ns m s ns m s ns m s m s cp frequency f c 2.0 mhz when reset signal is input from microcontroller etc. externally 250 ns (v dd =5.0v10%, v fl =C60v, ta=C40 to +85c, unless otherwise specified) t f c l =100pf 2.0 m s v dd off time t pof when mounted in the unit, v dd =0.0v 5.0 ms r 2 =1.0k w , c 2 =0.1 m f 200 m s reset time t rson when reset signal is input from microcontroller etc. externally 250 ns ac characteristics-1 ac characteristics-2 parameter symbol condition min. max. unit cp pulse width da setup time da hold time cs setup time cs hold time cs wait time data processing time reset pulse width da wait time all output slew rate v dd rise time t cw t ds t dh t css t csh t csw t doff t wres t rsoff t r t prz r 1 =3.3k w , c 1 =39pf r 1 =3.3k w , c 1 =39pf c l =100pf when mounted in the unit 250 250 250 250 16 250 8 250 2.0 100 ns ns ns ns m s ns m s ns m s m s cp frequency f c 2.0 mhz when reset signal is input from microcontroller etc. externally 250 ns (v dd =3.3v10%, v fl =C60v, ta=C40 to +85c, unless otherwise specified) t f 2.0 m s t r =20% to 80% t f =80% to 20% v dd off time t pof when mounted in the unit, v dd =0.0v 5.0 ms r 2 =1.0k w , c 2 =0.1 m f 200 m s reset time t rson when reset signal is input from microcontroller etc. externally 250 ns
? semiconductor ML9206-XX 11/32 timing diagram symbol v dd =3.3v10% v dd =5.0v10% v ih 0.8 v dd 0.7 v dd v il 0.2 v dd 0.3 v dd ? data timing ? reset timing v dd reset da t prz t rson t rsoff t pof t wres when external r and c are connected when input externally 0.8 v dd v ih 0.0 v v il v ih v il 0.5 v dd t rsoff = cs cp da t css t ds t dh t doff t cw t cw t csh t csw valid valid valid valid v ih v ih f c v il v il v ih v il ? output timing all outputs t f t r 0.8 v dd 0.2 v fl
? semiconductor ML9206-XX 12/32 ? digit output timing (for 16-digit display, at a duty of 240/256) com1 com2 com3 com4 com5 com6 com7 com8 com9 com10 com11 com12 com13 com14 com15 com16 ad1, 2 seg1-35 v fl t 1 =4096t t 2 =240t t 3 =16t frame cycle display timing blank timing v dd v fl v dd t=2/ f osc (t 1 =4.096 ms when f osc =2.0 mhz) (t 2 =240 m s when f osc =2.0 mhz) (t 3 =16 m s when f osc =2.0 mhz)
? semiconductor ML9206-XX 13/32 functional description commands list 1st byte 2nd byte lsb msb lsb msb command 1 dcram data write b0 b1 b2 b3 b4 b5 b6 b7 b0 b1 b2 b3 b4 b5 b6 b7 2 3 4 5 6 7 cgram data write adram data write general output port set display duty set number of digits set all lights on/off test mode c0 c1 c2 c3 c4 c5 c6 c7 c0 c5 c10 c15 c20 c25 c30 * c1 c6 c11 c16 c21 c26 c31 * c2 c7 c12 c17 c22 c27 c32 * c3 c8 c13 c18 c23 c28 c33 * c4 c9 c14 c19 c24 c29 c34 * c0c1****** x0x1x2x31000 x0x1x2*0100 x0x1x2x31100 p1p2**0010 ****1010 k0k1k2*0110 lh ** 1110 2nd byte 3rd byte 4th byte 5th byte 6th byte * xn cn pn dn kn h l : don't care : address specification for each ram : character code specification for each ram : general output port status specification : display duty specification : number of digits specification : all lights on instruction : all lights off instruction when data is written to ram (dcram, cgram, adram) continuously, addresses are internally incremented automatically. therefore it is not necessary to specify the 1st byte to write ram data for the 2nd and later bytes. note: the test mode is used for inspection before shipment. it is not a user function. d0 d1 d2 d3 d4 d5 d6 d7
? semiconductor ML9206-XX 14/32 positional relationship between segn and adn (one digit) c0 ad1 c0 seg1 c5 seg6 c10 seg11 c15 seg16 c20 seg21 c25 seg26 c30 seg31 c1 seg2 c6 seg7 c11 seg12 c16 seg17 c21 seg22 c26 seg27 c31 seg32 c2 seg3 c7 seg8 c12 seg13 c17 seg18 c22 seg23 c27 seg28 c32 seg33 c3 seg4 c8 seg9 c13 seg14 c18 seg19 c23 seg24 c28 seg29 c33 seg34 c4 seg5 c9 seg10 c14 seg15 c19 seg20 c24 seg25 c29 seg30 c34 seg35 adram written data. corresponds to 2nd byte cgram written data. corresponds to 2nd byte cgram written data. corresponds to 3rd byte cgram written data. corresponds to 4th byte cgram written data. corresponds to 6th byte cgram written data. corresponds to 5th byte c1 ad2
? semiconductor ML9206-XX 15/32 data transfer method and command write method display control command and data are written by an 8-bit serial transfer. write timing is shown in the figure below. setting the cs pin to "low" level enables a data transfer. data is 8 bits and is sequentially input into the da pin from lsb (lsb first). as shown in the figure below, data is read by the shift register at the rising edge of the shift clock, which is input into the cp pin. if 8-bit data is input, internal load signals are automatically generated and data is written to each register and ram. therefore it is not necessary to input load signals from the outside. setting the cs pin to "high" disables data transfer. data input from the point when the cs pin changes from "high" to "low" is recognized in 8-bit units. * when data is written to ram (dcram, adram, cgram) continuously, addresses are internally incremented automatically. therefore it is not necessary to specify the 1st byte to write ram data for the 2nd and later bytes. reset function reset is executed when the reset pin is set to "l", (when turning power on, for example) and initializes all functions. initial status is as follows. ? address of each ram .................. address "00"h ? data of each ram ........................ all contents are undefined ? general output port ..................... all general output ports go "low" ? display digit .................................. 16 digits ? brightness adjustment ................. 0/256 ? all display lights on or off ..... off mode ? segment output ............................ all segment outputs go "low" ? ad output ..................................... all ad outputs go "low" please set again according to "setting flowchart" after reset. t doff b0 lsb cs cp da b1 b2 b3 b4 b5 b6 b7 b0 b1 b2 b3 b4 b5 b6 b7 msb 1st byte lsb msb 2nd byte when data is written to dcram* command and address data t csh b0 b1 b2 b3 b4 b5 b6 b7 lsb msb 2nd byte character code data of the next address character code data
? semiconductor ML9206-XX 16/32 description of commands and functions 1. dcram data write (specifies the address of dcram and writes the character code of cgrom and cgram.) dcram (data control ram) has a 4-bit address to store character code of cgrom and cgram. the character code specified by dcram is converted to a 5 7 dot matrix character pattern via cgrom or cgram. (the dcram can store 16 characters.) [command format] x0x1x2x31000 b0 b1 b2 b3 b4 b5 b6 b7 1st byte (1st) lsb msb c0 c1 c2 c3 c4 c5 c6 c7 b0 b1 b2 b3 b4 b5 b6 b7 2nd byte (2nd) lsb msb : selects dcram data write mode and specifies dcram address (ex: specifies dcram address 0h) : specifies character code of cgrom and cgram (written into dcram address 0h) to specify the character code of cgrom and cgram continuously to the next address, specify only character code as follows. the addresses of dcram are automatically incremented. specification of the 1st byte is unnecessary.
? semiconductor ML9206-XX 17/32 hex x0 com x1 x2 x3 0 0000 com1 1 1000 com2 2 0100 com3 3 1100 com4 4 0010 com5 5 1010 com6 6 0110 com7 7 1110 com8 8 0001 com9 9 1001 com10 a 0101 com11 b 1101 com12 c 0011 com13 d 1011 com14 e 0111 com15 f 1111 com16 position c0 c1 c2 c3 c4 c5 c6 c7 b0 b1 b2 b3 b4 b5 b6 b7 2nd byte (3rd) lsb msb c0 c1 c2 c3 c4 c5 c6 c7 b0 b1 b2 b3 b4 b5 b6 b7 2nd byte (4th) lsb msb : specifies character code of cgrom and cgram (written into dcram address 1h) : specifies character code of cgrom and cgram (written into dcram address 2h) b0 b1 b2 b3 b4 b5 b6 b7 2nd byte (17th) lsb msb c0 c1 c2 c3 c4 c5 c6 c7 b0 b1 b2 b3 b4 b5 b6 b7 2nd byte (18th) lsb msb : specifies character code of cgrom and cgram (written into dcram address fh) : specifies character code of cgrom and cgram (dcram address 0h is rewritten) c0 c1 c2 c3 c4 c5 c6 c7 x0 (lsb) to x3 (msb): dcram addresses (4 bits: 16 characters) c0 (lsb) to c7 (msb): character code of cgrom and cgram (8 bits: 256 characters) [com positions and set dcram addresses]
? semiconductor ML9206-XX 18/32 c0 c5 c10 c15 c20 c25 c30 * b0 b1 b2 b3 b4 b5 b6 b7 2nd byte (2nd) lsb msb : specifies 1st column data (rewritten into cgram address 00h) c1 c6 c11 c16 c21 c26 c31 * b0 b1 b2 b3 b4 b5 b6 b7 3rd byte (3rd) lsb msb : specifies 2nd column data (rewritten into cgram address 00h) x0x1x2*0100 b0 b1 b2 b3 b4 b5 b6 b7 1st byte (1st) lsb msb : selects cgram data write mode and specifies cgram address. (ex: specifies cgram address 00h) c2 c7 c12 c17 c22 c27 c32 * b0 b1 b2 b3 b4 b5 b6 b7 4th byte (4th) lsb msb : specifies 3rd column data (rewritten into cgram address 00h) c3 c8 c13 c18 c23 c28 c33 * b0 b1 b2 b3 b4 b5 b6 b7 5th byte (5th) lsb msb : specifies 4th column data (rewritten into cgram address 00h) c4 c9 c14 c19 c24 c29 c34 * b0 b1 b2 b3 b4 b5 b6 b7 6th byte (6th) lsb msb : specifies 5th column data (rewritten into cgram address 00h) to specify character pattern data continuously to the next address, specify only character pattern data as follows. the addresses of cgram are automatically incremented. specification of the 1st byte is therefore unnecessary. the 2nd to 6th byte (character pattern data) are regarded as one data item, so 300 ns is sufficient for t doff time between bytes. 2. cgram data write (specifies the addresses of cgram and writes character pattern data.) cgram (character generator ram) has a 3-bit address to store 5 7 dot matrix character patterns. a character pattern stored in cgram can be displayed by specifying the character code (address) by dcram. the address of cgram is assigned to 00h to 07h. (all the other addresses are the cgrom addresses.) (the cgram can store 8 types of character patterns.) [command format]
? semiconductor ML9206-XX 19/32 c0 c5 c10 c15 c20 c25 c30 * b0 b1 b2 b3 b4 b5 b6 b7 2nd byte (7th) lsb msb : specifies 1st column data (rewritten into cgram address 01h) c4 c9 c14 c19 c24 c29 c34 * b0 b1 b2 b3 b4 b5 b6 b7 6th byte (11th) lsb msb : specifies 5th column data (rewritten into cgram address 01h) x0 (lsb) to x2 (msb): cgram addresses (3 bits: 8 characters) c0 (lsb) to c34 (msb) : character pattern data (35 bits: 35 outputs per digit) * : don't care [cgrom addresses and set cgram addresses] refer to romcode table hex x0 cgrom address x1 x2 00 000 ram00(00000000b) 01 100 ram01(00000001b) 02 010 ram02(00000010b) 03 110 ram03(00000011b) 04 001 ram04(00000100b) 05 101 ram05(00000101b) 06 011 ram06(00000110b) 07 111 ram07(00000111b)
? semiconductor ML9206-XX 20/32 positional relationship between the output area of cgrom and that of cgram note: cgrom (character generator rom) has an 8-bit address to generate 5 7 dot matrix character patterns. cgram can store 248 types of character patterns. general-purpose code -01 is available (see rom code list) and custom codes are provided on customer's request. c0 c5 c10 c15 c20 c25 c30 c1 c6 c11 c16 c21 c26 c31 c2 c7 c12 c17 c22 c27 c32 c3 c8 c13 c18 c23 c28 c33 c4 c9 c14 c19 c24 c29 c34 area that corresponds to 2nd byte (1st column) area that corresponds to 3rd byte (2nd column) area that corresponds to 5th byte (4th column) area that corresponds to 6th byte (5th column) area that corresponds to 4th byte (3rd column)
? semiconductor ML9206-XX 21/32 to specify symbol data continuously to the next address, specify only symbol data as follows. the address of adram is automatically incremented. specification of the 1st byte is therefore unnecessary. 3. adram data write (specifies address of adram and writes symbol data) adram (additional data ram) has a 2-bit address to store symbol data. symbol data specified by adram is directly output without cgrom and cgram. (the adram can store 2 types of symbol patterns for each digit.) the terminal to which the contents of adram are output can be used as a cursor. [command format] c0c1****** b0 b1 b2 b3 b4 b5 b6 b7 2nd byte (2nd) lsb msb : sets symbol data (written into adram address 0h) x0x1x2x31100 b0 b1 b2 b3 b4 b5 b6 b7 1st byte (1st) lsb msb : selects adram data write mode and specifies adram address (ex: specifies adram address 0h) c0c1****** b0 b1 b2 b3 b4 b5 b6 b7 2nd byte (3rd) lsb msb : sets symbol data (written into adram address 1h) c0c1****** b0 b1 b2 b3 b4 b5 b6 b7 2nd byte (4th) lsb msb : sets symbol data (written into adram address 2h) c0c1****** b0 b1 b2 b3 b4 b5 b6 b7 2nd byte (17th) lsb msb : sets symbol data (written into adram address fh) c0c1****** b0 b1 b2 b3 b4 b5 b6 b7 2nd byte (18th) lsb msb : sets symbol data (adram address 0h is rewritten.) x0 (lsb) to x3 (msb) : adram addresses (4 bits: 16 characters) c0 (lsb) to c1 (msb): symbol data (2 bits: 2-symbol data per digit) * : don't care
? semiconductor ML9206-XX 22/32 [com positions and adram addresses] 4. general output port set (specifies the general output port status) the general output port is an output for 2-bit static operation. it is used to control other i/o devices and turn on led. (static operation) when at the "high" level, this output becomes the v dd voltage, and when at the "low" level, it becomes the ground potential. therefore, the fluorescent display tube cannot be driven. [command format] p1, p2 : general output port * : don't care [set data and set state of general output port] p1p2**0010 b0 b1 b2 b3 b4 b5 b6 b7 1st byte lsb msb : selects a general output port and specifies the output status p2 0 0 display state of general output port sets p1 and p2 to low sets p1 to high and p2 to low (the state when power is applied or when reset is input.) p1 0 1 1 sets p1 to low and p2 to high 0 1 sets p1 and p2 to high 1 hex x0 com x1 x2 x3 0 0000 com1 1 1000 com2 2 0100 com3 3 1100 com4 4 0010 com5 5 1010 com6 6 0110 com7 7 1110 com8 8 0001 com9 9 1001 com10 a 0101 com11 b 1101 com12 c 0011 com13 d 1011 com14 e 0111 com15 f 1111 com16 position
? semiconductor ML9206-XX 23/32 5. display duty set (writes display duty value to duty cycle register) display duty adjusts brightness in 256 stages using 8-bit data. (maximum brightness=240/256) when power is turned on or when the reset signal is input, the duty cycle register value is "0". always execute this instruction before turning the display on, then set a desired duty value. [command format] d0 (lsb) to d7 (msb) : display duty data (8 bits: 256 stages) * : don't care [relation between setup data and controlled com duty] ****1010 b0 b1 b2 b3 b4 b5 b6 b7 1st byte lsb msb : selects display duty set mode and sets duty value d0 d1 d2 d3 d4 d5 d6 d7 b0 b1 b2 b3 b4 b5 b6 b7 2nd byte lsb msb : sets display duty value hex d0 d1 d2 com duty 00 0 0 0 0/256 01 1 0 0 1/256 02 0 1 0 2/256 f7 1 1 1 239/256 f8 0 0 0 240/256 ff 1 1 1 240/256 d3 0 0 0 0 1 1 d4 0 0 0 1 1 1 d5 0 0 0 1 1 1 d6 0 0 0 1 1 1 d7 0 0 0 1 1 1 *the state when power is turned on or when reset signal is input. no brightness change du to fixed blank time (16/256)
? semiconductor ML9206-XX 24/32 6. number of digits set (writes the number of display digits to the display digit register) the number of digits set can display 1 to 16 digits using 4-bit data. when power is turned on or when a reset signal is input, the number of digit register value is "0". always execute this instruction to change the number of digits before turning the dispaly on. [command format] k0 (lsb) to k3 (msb) : number of digit data (4 bits: 16 digits) * : don't care [relation between setup data and controlled com] k0k1k2k30110 b0 b1 b2 b3 b4 b5 b6 b7 1st byte lsb msb : selects the number of digit set mode and specifies the number of digit value hex k0 k1 k2 number of digits of com 0 0 0 0 com1 to 16 1 1 0 0 com1 2 0 1 0 com1 to 2 3 1 1 0 com1 to 3 4 0 0 1 com1 to 4 5 1 0 1 com1 to 5 6 0 1 1 com1 to 6 7 1 1 1 com1 to 7 k3 0 0 0 0 0 0 0 0 hex k0 k1 k2 number of digits of com 8 0 0 0 com1 to 8 9 1 0 0 com1 to 9 a 0 1 0 com1 to 10 b 1 1 0 com1 to 11 c 0 0 1 com1 to 12 d 1 0 1 com1 to 13 e 0 1 1 com1 to 14 f 1 1 1 com1 to 15 k3 1 1 1 1 1 1 1 1 *the state when power is turned on or when reset signal is input.
? semiconductor ML9206-XX 25/32 7. all display lights on/off set (turns all dispaly lights on or off) all display lights on is used primarily for display testing. all display lights off is primarily used for display blink and to prevent malfunction when power is turned on. this command cannot control the general output port. [command format] lh ** 1110 b0 b1 b2 b3 b4 b5 b6 b7 1st byte lsb msb : selects all display lights on or off mode l: sets all lights off h: sets all lights on *: don't care [set data and display state of seg and ad] h 0 0 1 1 normal display sets all outputs to low sets all outputs to high sets all outputs to high display state of seg and ad l 0 1 0 1 (the state when power is applied or when reset is input.) (all lights on mode has priority.)
? semiconductor ML9206-XX 26/32 setting flowchart (power applying included) apply v fl all display lights off number of digits setting display duty setting cgram data write mode (with address setting) cgram character code cgram is character code write ended? another ram to be set? general output port setting releases all display lights off mode adram data write mode (with address setting) adram character code adram is character code write ended? dcram data write mode (with address setting) dcram character code dcram is character code write ended? select a ram to be used status of all outputs by reset signal input display operation mode address is automatically incremented no no no yes yes yes yes end address is automatically incremented address is automatically incremented apply v dd no
? semiconductor ML9206-XX 27/32 power-off flowchart display operation mode turn off v dd turn off v fl
? semiconductor ML9206-XX 28/32 application circuit notes: 1. the v dd value depends on the power supply voltage of the microcontroller used. adjust the values of the constants r 1 , r 2 , r 4 , c 1 , and c 2 to the power supply voltage used. 2. the v fl value depends on the fluorescent display tube used. adjust the values of the constants r 3 and zd to the power supply voltage used. ML9206-XX micro- controller 16 35 2 reset v dd com1-16 seg1-35 ad1, 2 v dd gnd r 2 c 2 gnd r 1 c 1 v fl osc0 osc1 da cp cs output port p1, 2 r 3 c 3 c 4 v dd v fl zd 2 5 7-dot matrix fluorescent display tube grid (digit) anode (segment) anode (segment) heater transformer r 4 led v dd npn tr gnd gnd gnd v dd
? semiconductor ML9206-XX 29/32 reference data the figure below shows the relationship between the v fl voltage and the output current of each driver. take care that the total power consumption to be used does not exceed the power dissipation. C30 C25 C20 C15 C10 C5 0 C10 C20 C30 C40 C50 C60 output current (ma) v fl voltage (v dd-n ) com1 to com16 (condition: v oh =v dd C1.5 v) ad1 and ad2 (condition: v oh =v dd C1.5 v) seg1 to seg35 (condition: v oh =v dd C1.5 v) (v) (ma) v fl voltage-output current of each driver
? semiconductor ML9206-XX 30/32 ml9206-01 rom code 00000000b (00h) to 00000111b (07h) are the cgram addresses. 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 ram0 ram1 ram2 ram3 ram4 ram5 ram6 ram7 msb lsb
? semiconductor ML9206-XX 31/32 (unit : mm) package dimensions notes for mounting the surface mount type package the sop, qfp, tsop, tqfp, lqfp, soj, qfj (plcc), shp, and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). qfp64-p-1414-0.80-bk package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 0.87 typ. mirror finish
? semiconductor ML9206-XX 32/32 (unit : mm) notes for mounting the surface mount type package the sop, qfp, tsop, tqfp, lqfp, soj, qfj (plcc), shp, and bga are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact okis responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). ssop64-p-525-0.80-k package material lead frame material pin treatment solder plate thickness package weight (g) epoxy resin 42 alloy solder plating 5 m m or more 1.34 typ. mirror finish
notice 1. the information contained herein can change without notice owing to product and/or technical improvements. before using the product, please make sure that the information being referred to is up-to-date. 2. the outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. when planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. when designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. neither indemnity against nor license of a third partys industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. no responsibility is assumed by us for any infringement of a third partys right which may result from the use thereof. 6. the products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). these products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. certain products in this document may need government approval before they can be exported to particular countries. the purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. no part of the contents contained herein may be reprinted or reproduced without our prior permission. 9. ms-dos is a registered trademark of microsoft corporation. copyright 1999 oki electric industry co., ltd. printed in japan e2y0002-29-62

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